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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service

Shenzhen Xinchenger Electronic Co.,Ltd
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Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service

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Brand Name : XCE

Model Number : XCEF

Certification : CE,ROHS, FCC,ISO9008

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union, L/C, MoneyGram

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Layer : 2 layer

Color : green

Material : FR4

Surface : HASL lead free

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Turnkey Solar Inverter FR4 PCB Circuit Board With Design Service
 
Specification:   

 

Layers:2 Material:FR4
Board thickness:1.2MM Copper thickness:1.5OZ
Min hole size:8mil Min line space:8mil
Min line width:8mil Surface:Lead free
Solder mask color: green Certificate:Iso9001,SGS

 

 

Parameter:

 

Copper thickness in hole

 >25.0 um (>1mil)

 

Size

Max. Board Size: 23 × 25 (580mm×900mm)

Min. Drilled Hole Size: 3mil (0.075mm)

Min. Line Width: 3mil (0.075mm)

Min. Line Spacing: 3mil (0.075mm)

 

Surface finishing

 HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating 

 

Tolerance

 

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076                 NPTH: ±0.05

Certificate

 UL, ISO 9001, ISO 14001

Special requirements

 Buried and blind vias+controlled impedance +BGA

Profiling

 Punching, Routing, V-CUT, Beveling

Any other special material please feel free to let us know

 

 

 

Application:
 
telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.

 


Description:

 

Standard products(4, 6 layers), FR4, photo-sensitive soldermask

Special types (thick copper, thin core, hard gold, etc)

High layer count(8-40 layers)

High Density Interconnection (HDI): micro-via technology, build-up construction, laser holes, very small tracks, etc…

Low cost CPTH: polymer conductive holes with copper paste. 4 layers, FR4

Back panels: thick PCBs, press-fit technology, large size PCBs.

Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service

 

 

 
 
 

 


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